129 lines
5.7 KiB
Plaintext
129 lines
5.7 KiB
Plaintext
KiCad Library Convention
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========================
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Revision 0.7, September 18th 2014
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Devised by Carl Poirier
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With help from members of:
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kicad-lib-committers@lists.launchpad.net
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kicad-developers@lists.launchpad.net
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1. General Rules
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----------------
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1.1. Writing uses C-style naming with the first letter of each word being capitalized. Ex: "Socket_Strip_Straight_2x06"
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1.2. Every acronym has all of its letters capitalized.
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1.3. Manufacturer name is capitalized as usual. Ex: NEC, Microchip
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1.4. When dimensions are used in part name, they are in millimeters, decimal places separated by a dot, and unit is not capitalized. Ex: "Cap_10x13mm_RM5"
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1.5. Filename is the same as the part name.
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1.6. The order of elements in names must be the same as the enumerations presented in this document.
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2. Symbol Library Names (.lib files)
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------------------------------------
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2.1. Manufacturer.
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2.2. Category or family of parts. ex: "Capacitors", "Spartan6", etc.
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3. General Rules for Symbols
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----------------------------
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3.1. Using a 100mil grid, pin ends and origin must lie on grid nodes (IEC-60617).
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3.2. Pin has a length of 100mil or more in increments of 50mil if number needs more space.
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3.3. Origin is placed in the middle of symbol.
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3.4. Black-box components group pins logically, for example by function set, and ports in counter-clockwise position.
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3.5. Whenever possible, inputs are on the left and outputs are on the right.
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3.6. Field text uses a common size of 50mils.
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3.7. The reference field is prefilled with the reference designator of the symbol (IEEE 315-1975).
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3.8. The Value field is prefilled with the object name.
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4. Symbol Names
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---------------
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4.1. Name of symbol, may be shortened for common components or use reference designator of the symbol (IEEE 315-1975). ex: "Conn_4x2", "C", etc.
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4.2. Manufacturer.
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4.3. Part number, including extension for specific footprint. (JEDEC for common devices, ex: 1N4001)
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4.4. Any modification to the original symbol, indicated by appending the reason. Ex: different pin ordering: "Transistor_PNP_Pinswap1"
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4.5. Indication of quantity if symbol is an array. ex: resistor array: "Resistor_x8"
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5. Footprint Library Names (.pretty repositories)
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-------------------------------------------------
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5.1. Part type (resistor, cap, etc), must be in plural form.
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5.2. Package type (SOIC, SMD, etc).
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5.3. Manufacturer.
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5.4. Part number.
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6. General Rules for Footprints
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-------------------------------
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6.1. Follows datasheet recommendation unless intentional variation, for example longer pads for hand soldering.
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6.2. Pad 1 is on the left first, then at the top, except at the top for PLCC (IPC-7351).
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6.3. For through-hole components, footprint anchor is set on pad 1.
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6.4. For surface-mount devices, footprint anchor is placed in the middle with respect to device lead ends. (IPC-7351)
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6.5. Silkscreen is not superposed to pads, its outline is completely visible after board assembly, uses 0.15mm line width and provides a reference mark for pin 1. (IPC-7351)
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6.6. Courtyard has a clearance of 0.25mm, except aluminum capacitors at 0.5mm and BGA at 1.0mm, all rounded on a grid of 0.05mm. (IPC-7351)
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6.7. Cannot be duplicated to match a different pin ordering. This is to be handled in the symbol libraries.
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6.8. Footprint name must match its filename. (.kicad_mod files)
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6.9. The value and reference designator must be placed on silkscreen.
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7. Names for footprints of Surface-Mount Devices (SMD)
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------------------------------------------------------
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7.1. Specific package feature first, not separated by anything. Ex: "TSSOP"
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7.2. Package name, numbers separated from letters using hyphen. Ex: "SOT-89"
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7.3. Variation of package, separated by another hyphen. Ex: SOT-23 with 5 pins: "SOT-23-5", Exposed pad under package: "QFP-48-1EP"
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7.4. If it's a manufacturer-specific package, name can be appended, separated by an underscore.
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7.5. Any modification to the original footprint, indicated by appending the reason. Ex: longer pads used to facilitate hand soldering of a QFN component: "QFN-52_HandSoldering"
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8. Names for footprints of common devices, such as resistors, capacitors, etc
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-----------------------------------------------------------------------------
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8.1. Name of part, may be shortened for common components. ex: "Cap", "Socket_Strip", etc.
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8.2. Dimension, which may include at its end the positioning. Ex: "5x7mm_Horiz", "1x02_Angled"
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8.3. Pad distance, in the form of an RM rating.
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8.4. Any modification to the original footprint, indicated by appending the reason.
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9. Names for footprints of specific devices
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-------------------------------------------
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9.1. Name of part.
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9.2. Part number. Ex: "Oscillator_SI570"
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9.4. Any modification to the original footprint, indicated by appending the reason.
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Changelog
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---------
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Revision 0.1, May 8th 2014
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1. Initial Commit
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Revision 0.2, May 19th 2014
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1. Minor clarifications to few items.
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2. Exposed pad is now considered as a variation of a package, thus separated by hyphen instead of plus sign.
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3. Added 2-level numbering.
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Revision 0.3, June 8th 2014
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1. Specified that pin ordering duplicates are to be handled in symbol libraries.
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2. Specified the rules for footprint silkscreen.
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Revision 0.4, July 30th 2014
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1. Completion of convention for symbols.
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2. Rule 6.7 moved from section 1 since it pertains only to footprints.
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Revision 0.5, August 6th 2014
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1. Specified in 6.5 that only the outline must be completely visible after assembly.
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2. Rule 3.8 moved from section 1 since it pertains only to symbols.
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Revision 0.6, September 14th 2014
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1. Specified in 6.9 that value and reference designators must be placed on silkscreen.
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Revision 0.7, September 18th 2014
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1. Added rule 6.6 for courtyard
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