From a721bc498eff6a6a194d45ea8aee1b2bd7267034 Mon Sep 17 00:00:00 2001 From: CarlPoirier Date: Tue, 1 Jul 2014 20:07:56 -0400 Subject: [PATCH] Specified target 0.15mm process for silkscreen. --- KiCad_Library_Convention.txt | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-) diff --git a/KiCad_Library_Convention.txt b/KiCad_Library_Convention.txt index 6d755333..b5f4f4a7 100644 --- a/KiCad_Library_Convention.txt +++ b/KiCad_Library_Convention.txt @@ -60,7 +60,7 @@ TODO 6.2. Pad 1 is on the left first, then at the top, except at the top for PLCC (IPC-7351). 6.3. For through-hole components, origin is set on pad 1. 6.4. For surface-mount devices, origin is placed in the middle with respect to device lead ends (IPC-7351). -6.5. Silkscreen is not superposed to pads, is completely visible after board assembly, and provides a reference mark for pin 1. +6.5. Silkscreen is not superposed to pads, is completely visible after board assembly, uses 0.15mm line width and provides a reference mark for pin 1. (IPC-7351) 6.6. Cannot be duplicated to match a different pin ordering. This is to be handled in the symbol libraries.