Completion of convention for symbols

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CarlPoirier 2014-07-30 11:42:34 -04:00
parent 8dcf41df23
commit 6db9f430ce

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@ -13,17 +13,17 @@ kicad-developers@lists.launchpad.net
1.1. Writing uses C-style naming with the first letter of each word being capitalized. Ex: "Socket_Strip_Straight_2x06"
1.2. Every acronym has all of its letters capitalized.
1.3. Manufacturer name is capitalized as usual. Ex: NEC, Microchip
1.4. Component name must match its filename
1.5. When dimensions are used in part name, they are in millimeters, decimal places separated by a dot, and unit is not capitalized. Ex: "Cap_10x13mm_RM5"
1.6. Filename is the same as the part name.
1.7. The Value field must be prefilled with the object name.
1.8. The order of elements in names must be the same as the enumerations presented in this document.
1.4. When dimensions are used in part name, they are in millimeters, decimal places separated by a dot, and unit is not capitalized. Ex: "Cap_10x13mm_RM5"
1.5. Filename is the same as the part name.
1.6. The Value field must be prefilled with the object name.
1.7. The order of elements in names must be the same as the enumerations presented in this document.
2. Symbol Library Names (.lib files)
------------------------------------
TODO
2.1. Manufacturer.
2.2. Category or family of parts. ex: "Capacitors", "Spartan6", etc.
3. General Rules for Symbols
@ -41,7 +41,11 @@ TODO
4. Symbol Names
---------------
TODO
4.1. Name of symbol, may be shortened for common components or use reference designator of the symbol (IEEE 315-1975). ex: "Conn_4x2", "C"etc.
4.2. Manufacturer.
4.3. Part number, including extension for specific footprint. (JEDEC for common devices, ex: 1N4001)
4.4. Any modification to the original footprint, indicated by appending the reason. Ex: different pin ordering: "transistor_PNP_pinswap1"
4.5. Indication of quantity if symbol is an array. ex: resistor array: "Resistor_x8"
5. Footprint Library Names (.pretty repositories)
@ -62,6 +66,7 @@ TODO
6.4. For surface-mount devices, origin is placed in the middle with respect to device lead ends (IPC-7351).
6.5. Silkscreen is not superposed to pads, is completely visible after board assembly, uses 0.15mm line width and provides a reference mark for pin 1. (IPC-7351)
6.6. Cannot be duplicated to match a different pin ordering. This is to be handled in the symbol libraries.
6.7. Footprint name must match its filename (.kicad_mod files)
7. Names for footprints of Surface-Mount Devices (SMD)
@ -98,11 +103,14 @@ Changelog
1. Initial Commit
Revision 0.2, May 19th 2014
1. Minor clarifications to few items
1. Minor clarifications to few items.
2. Exposed pad is now considered as a variation of a package, thus separated by hyphen instead of plus sign.
3. Added 2-level numbering
3. Added 2-level numbering.
Revision 0.3, June 8th 2014
1. Specified that pin ordering duplicates are to be handled in symbol libraries.
2. Specified the rules for footprint silkscreen.
Revision 0.4, July 30th 2014
1. Completion of convention for symbols.
2. Rule 6.7 moved away from section 3 since it pertains only to footprints.